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Optimizing Assembly with Advanced PCB Soldering Techniques

In today’s interconnected world, devices are interdependent on mechanical and electrical designs. Mechanical assemblies are increasingly being connected with electronic features — the brain of which is the printed circuit board (PCB). Automated PCB handling and soldering techniques play a vital role in ensuring these circuits are safely installed with robust electrical connections.

A strong automation partner will excel in helping manufacturing leaders employ advanced techniques for high-quality solder joints. They’ll also design their system to protect the manufacturer’s electronic assembly by adhering to best practices and industry standards set out in ANSI/ESD-S20.20. Selecting the correct soldering process enables manufacturers to comply with critical industry standards like IPC-A-610. By understanding each product’s specific requirements and utilizing precise tooling, teams can optimize these PCB loading and soldering techniques for performance and reliability.

Challenges with PCB Handling and Soldering

PCB Design Complexity: Consider design elements that would be conducive to automated processes. Manufacturers need appropriate “keep out” areas for grippers to handle the boards. They must also be mindful of traces within the PCB’s sub-layers. Some techniques, like inductive soldering, can heat up sections outside the targeted area and potentially damage the PCB.

Quantity of Solder Joints: Minimize the solder joints needed. Each joint increases the opportunities for failure.

Handling Sensitivity: PCBs often contain many parts that are sensitive to electrostatic discharge (ESD). It is imperative to ensure the automation includes ESD-safe best practices.

Surface Preparation: Ensure the surfaces to be soldered are clean and free of residue and oxides. This is crucial to achieve reliable solder joints.

Process Control: Maintaining precise control over soldering parameters, such as temperature and solder volume, prevents defects and ensures consistent quality.

         

Every PCB soldering project is unique. Allow us to listen to your challenges and share how automation can launch your project on time.

Our Approach

Consumer Product Testing

Advanced Defect Detection

Depending on the application, ATS Industrial Automation experts recommend 2D vision systems and 3D X-ray scanners to help identify defects and ensure the integrity of the solder joints.

Two ATS employees working on equipment

Electrostatic Discharge Protection

ATS implements ESD-safe contact points, tooling, guarding, air ionizers, and bonding methods that protect PCBs from electrostatic discharge.

Soldering

Versatile Methods

Our various soldering approaches meet diverse project needs, including contact, laser, vacuum reflow, induction, and selective soldering.

Employee looking at a screen containing data from a monitor & trace program.

Process Optimization

We optimize soldering efforts with precise tooling and robust process development to achieve high-quality, reliable results that meet the required specifications and cycle times.

Soldering Methods

Laser Soldering

A precise and efficient method, teams can use laser soldering to join components on a PCB. Laser energy heats the solder and components without physical contact, ensuring minimal thermal stress and high accuracy. This technique is particularly beneficial for delicate or densely packed PCBs, where traditional methods might cause damage. The method is also ideal for applications requiring high precision and quality, such as medical devices, central processing units (CPUs), and consumer electronics.

Vacuum Reflow Soldering

This effective method creates reliable joints using a vacuum environment to eliminate voids and ensure optimal solder flow. The technique involves placing a solder preform between the components, before heating them in a specialized oven. The vacuum helps remove any trapped air or gases between the components and the PCB, resulting in a more uniform and robust joint. This method is beneficial for applications that need high reliability and precision, such as automotive electronics or aerospace devices. 

Induction Soldering

This method uses an induction coil to generate an alternating magnetic field, which heats the components to be joined without direct contact. The technique is ideal for applications requiring controlled temperatures, such as devices for vehicles, heating, ventilation, and air conditioning (HVAC) systems, and consumer electronics. The process also ensures minimal thermal stress on components, making it suitable for fragile or densely packed PCBs.

Contact Soldering

A metal tip, or soldering iron, applies heat to the parts that need to be joined. This method relies on conduction to transfer heat from the iron to the components, allowing the solder to wet out around the parts and create a strong bond. The process requires precise control of temperature and solder volume to create high-quality joints. The approach is widely used due to its simplicity and effectiveness in creating solid electrical connections.

Selective Soldering

This specialized technique joins specific components on a PCB without affecting surrounding areas. The method involves using a nozzle to precisely apply molten solder to the targeted spots, ensuring sturdy, reliable connections. The process is ideal for applications where components are densely packed or where traditional soldering methods might cause damage to the PCBs.